Bridge to a sustainable society by way of innovative integrated electronics systems
The Tohoku University Center for Innovative Integrated Electronic Systems(CIES) will host its fourth technology forum in Tokyo from March 22~23.
CIES is engaged in research and development with domestic and international companies to create the latest in energy-saving integrated electronics technology. Industry collaborators include specialists in the fields of materials, equipment, devices, circuits and systems.
The center will introduce its activities at the 4th CIES Technology Forum.
Day one of the forum will focus on the integrated electronics contributing to growth industries in IT and transportation systems. On day two of the forum, CIES will hold a progress report on activities at the center, including joint research, national and regional collaborative projects.
Day 1: International Symposium (& banquet)
Date: Thursday, March 22
Time: 10:30 a.m.~5:30 p.m
Day 2: CIES Progress Report
Date: Friday, March 23,
Time: 10:00 a.m.~5:50 p.m.
- Venue:
- Station Conference Tokyo Sapia Tower 5F
1-7-12 Marunouchi, Chiyoda-ku, Tokyo 100-0005
Attendees: domestic and foreign researchers in industry and academia, and government officials.
Participation is free (a separate fee applies for the banquet)
To attend, please apply online at the link below:
http://www.cies.tohoku.ac.jp/4th_forum/entry.html
Deadline: Wednesday, March 14 at 3 p.m.
The international symposium will be held in English while the CIES progress report will be in Japanese.
雷速体育_中国足彩网¥在线直播:
Tohoku University Center for Innovative Integrated Electronic SystemsEmail: support-office@cies.tohoku.ac.jp
Tel: +81-22-796-3410