雷速体育_中国足彩网￥在线直播

The 雷速体育_中国足彩网￥在线直播 Institute of Electrical Communication (RIEC) at Tohoku University is recruiting for the following position.

Position

Title:	Professor
Affiliation:	Innovative Information and Communication Devices Laboratory (tentative), Information Communication System Platforms Division, 雷速体育_中国足彩网￥在线直播 Institute of Electrical Communication (RIEC)
Term of Employment:	Full-time (no term)
Location:	雷速体育_中国足彩网￥在线直播 Institute of Electrical Communication (RIEC), 2-1-1 Katahira, Aoba, Sendai, 980-8577, Japan
Start Date:	As early as possible after April 2026

Job Description

This laboratory is seeking skilled individuals who can conduct research and education on innovative information and communication devices, particularly focusing on semiconductor devices. They should strive for innovation, and base their research on new materials or new operating principles.

RIEC strives to create sustainable, novel devices that break through conventional technological limits - such as ultra-high-speed optical and wireless communication devices operating with extremely low power consumption and highly reliable photonic and electronic devices with a long-term operational stability even in extreme environments.

The successful candidate will belong to RIEC and conduct research there. In addition, they will be in charge of teaching and supervising students at the Department of Electrical, Information and Physics Engineering in the School of Engineering, and the Graduate School of Engineering.

For further details, including how to apply, please see here.

Qualifications

• Must hold a doctoral degree (Ph.D.)
• Excellent research achievements and skills
• Regardless of nationality, the applicant must have the ability to communicate properly with faculty, staff, and students

How to Apply

Please submit the following materials via email:

1. Curriculum vitae (in any format), which includes a portrait photo, educational and professional experience, rewards, and contact information.
2. A list of research and educational achievements, which includes original journal papers, conference papers (with refereed/non-refereed clarified), invited talks (domestic/international), tutorials, books, patents, awards, educational activities, academic society activities, past/current research grants (the amount and your role in the grant), and other achievements. All achievements must be categorized as above.
3. PDF files of five major research papers, with a summary (about 100 words each).
4. A summary of the applicant's past research work in about two pages. Citations from (2), figures, and tables may be included.
5. The applicant's plan on education and research (approximately one page).
6. The names of two people who can serve as references and their affiliation, position, and contact details (mailing address, phone number, and e-mail address).

The submissions are only accepted via e-mail to riec-somu@grp.tohoku.ac.jp and the subject must be "Faculty Application Document_Innovative Information and Communication Devices Laboratory_APPLICANT" where "APPLICANT" is replaced with the applicant's name. All files should be PDF format, compressed into a single ZIP file, and named such that the contents can be easily identified. Applicants will receive an email confirming receipt of your documents within a few days after the submission. If you do not receive the email, please contact RIEC.

Application Deadline: October 31, 2025

About the Institute

Founded in 1935, the 雷速体育_中国足彩网￥在线直播 Institute of Electrical Communication (RIEC) at Tohoku University has long served as a center of excellence in information and communication technologies (ICT). RIEC's mission is to "realize a new paradigm of communications that enriches people's lives." Its research spans the full spectrum of communication - from human-to-human to machine-to-machine interactions - aiming to overcome limitations of speed, volume, and quality. With a strong foundation in areas such as magnetic recording, semiconductor devices, and optical communication, the Institute has consistently driven innovation through interdisciplinary collaboration, combining hardware and software technologies, and engaging with both academic and industrial partners.